Rogers TMM10i 2-Layer 30mil ENIG PCB – High Frequency Microwave Applications

1. Introduction to Rogers TMM10i PCB

Rogers TMM 10i isotropic thermoset microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability strip-line and micro-strip applications. TMM 10i microwave material has an isotropic dielectric constant (Dk). Like the other TMM series materials, TMM 10i combines many of the desirable features of ceramic and PTFE substrates, with the ease of soft substrate processing techniques.

TMM10i laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material's isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. This 2-layer rigid PCB is constructed entirely with TMM10i as the core material, making it ideal for RF and microwave circuitry, power amplifiers, satellite communication, GPS antennas, patch antennas, and chip testers.

2. Key Features of Rogers TMM10i PCB

• Dielectric Constant (Dk): 9.80 ± 0.245 at 10 GHz

• Dissipation Factor: 0.0020 at 10 GHz

• Thermal coefficient of Dk: -43 ppm/°K

• CTE matched to copper (X/Y/Z): 19/19/20 ppm/K (0 to 140°C)

• Decomposition Temperature (Td): 425 °C TGA

• Thermal Conductivity: 0.76 W/m/K

• Isotropic dielectric constant (Dk) for consistent performance

• Mechanical properties resist creep and cold flow

• Resistant to process chemicals, reducing damage during fabrication

• Material does not require sodium napthanate treatment prior to electroless plating

• Based on thermoset resin, allowing for reliable wire-bonding

• Available in thickness range .0015" to .500" ± .0015"

3. Benefits of Rogers TMM10i PCB

• Combines benefits of ceramic and PTFE substrates without specialized production techniques

• Exceptional Dk uniformity (9.80 ± 0.245) for consistent impedance control

• Low dissipation factor (0.0020) ensures high performance at microwave frequencies

• CTE matched to copper enables high reliability plated through holes

• High thermal conductivity (0.76 W/m/K) facilitates heat removal

• Thermoset resin does not soften when heated, preventing pad lifting during wire bonding

• Resistant to etchants and solvents used in PCB production

• Can replace alumina substrates in many applications

• Reliable wirebonding performance

4. PCB Construction Details

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 (Top) – 35 μm (1 oz)

Rogers TMM10i Core – 0.762 mm (30mil)

Copper_layer_2 (Bottom) – 35 μm (1 oz)

Total thickness: 0.8mm (including copper layers)

6. PCB Statistics

Components: 19

Total Pads: 52

Thru Hole Pads: 38

Top SMT Pads: 14

Bottom SMT Pads: 0

Vias: 18

Nets: 2

7. Rogers TMM10i Material – Product Introduction

TMM thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications. TMM laminates are available in a wide range of dielectric constants and claddings.

The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials. TMM laminates do not require a sodium napthanate treatment prior to electroless plating.

TMM laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation. TMM laminates combine many of the desirable features of ceramic substrates with the ease of soft substrate processing techniques.

8. Features and Benefits Summary

9. TMM10i Typical Properties (Data Sheet)

10. Primary Application Areas

• RF and microwave circuitry

• Power amplifiers and combiners

• Filters and couplers

• Satellite communication systems

• Global Positioning Systems Antennas

• Patch Antennas

• Dielectric polarizers and lenses

• Chip testers

11. Quality Assurance

• Type of artwork supplied: Gerber RS-274-X

• Accepted standard: IPC-Class-2

• Availability: Worldwide

• 100% Electrical test prior to shipment

12. Standard Thicknesses, Panel Sizes & Claddings